Intel® Xeon® Gold Processors
With support for higher memory speeds, enhanced memory capacity, and up-to four-socket scalability, Intel® Xeon® Gold 6300 and 5300 processors deliver improved performance, enhanced memory capabilities, advanced security technologies, and built-in workload acceleration.
These processors are optimized for demanding mainstream data center, cloud compute, and network and storage workloads. With up to four-socket scalability, they are suitable for an expanded range of workloads.
3rd Gen Intel Xeon Scalable Processors Are...
Optimized for cloud, enterprise, HPC, network, security, and IoT workloads with 8 to 40 powerful cores and a wide range of frequency, feature, and power levels.
Infused with Intel Crypto Acceleration, increasing the performance of encryption intensive workloads including SSL web serving, 5G infrastructure, and VPN/ firewalls, while reducing the performance impact of pervasive encryption.
The only data center CPU with built-in AI acceleration, end-to-end data science tools, and an ecosystem of smart solutions.
Engineered for the demands of cloud workloads and to support a wide range of XaaS environments.
Powered by Intel SGX, which protects data and application code while in use from the edge to the data center and multi-tenant public cloud.
Product Information |
|
Transource eSKU |
1000344362 |
Manufacturer |
Intel Corporation |
Manufacturer Part Number |
BX806896336Y |
Manufacturer Website Address |
http://www.intel.com |
Brand Name |
Intel |
Product Line |
Xeon Gold |
Product Series |
6300 |
Product Model |
6336Y |
Product Name |
Xeon Gold Tetracosa-core 6336Y 2.40GHz Server Processor |
Product Type |
Processor |
Technical Specifications |
|
Technical Information |
Processor Manufacturer |
Intel |
Processor Core |
Tetracosa-core (24 Core) |
Clock Speed |
2.40 GHz |
Overclocking Speed |
3.60 GHz |
QuickPath Interconnect |
11.20 GT/s |
L3 Cache |
36 MB |
64-bit Processing |
Yes |
Process Technology |
10 nm |
Processor Threads |
48 |
Processor Socket |
Socket LGA-4189 |
Processor Generation |
3rd Gen |
Power Description |
Thermal Design Power |
185 W |
Environmental Conditions |
Thermal Specification |
176°F (80°C) |
Physical Characteristics |
Width |
3.1" |
Depth |
2.2" |